| PART |
Description |
Maker |
| IBM11N4845BB IBM11N4845CB |
4M x 72 Chip-Kill Protect ECC-on-DIMM Module(4M x 72 带纠错代码保护的小外形双列直插动态RAM模块) 4米72片，杀死保护ECC的上内存模块米72带纠错代码保护的小外形双列直插动态内存模块）
4M x 72 Chip-Kill Protect ECC-on-DIMM Module(4M x 72 甯????唬????ょ?灏??褰㈠?????????AM妯″?)
|
International Business Machines, Corp.
IBM Microeletronics
|
| JE93I9HTR5 JE9 JE9112HR1 JE9112HR2 JE9112HR3 JE911 |
Digital Media System-on-Chip (DMSoC) 338-NFBGA 大功率磁保持继电
2.0mV Quad Ultra Micropower Rail-to-Rail CMOS Operational Amplifier, 24L SOIC 大功率磁保持继电
HIGH POWER LATCHING RELAY 大功率磁保持继电
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 4.6mJ, 68msec@25mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 55mJ, 88msec@150mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 8.3mJ, 80msec@25mA
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 30mJ, 75msec@150mA
SOIC socket added to Adapter Module
|
Hongfa Relay
???瀹???靛０?′唤??????
Xiamen Hongfa Electroacoustic Co., Ltd.
厦门宏发电声股份有限公司
HONGFA[Hongfa Technology]
|
| HT2MOA3S20 HT2MOA3S20_E_1 HT2MOA3S20_E_3 HT2MOA3S2 |
HITAGTM2 Chip Module
|
NXP Semiconductors N.V.
Philips Semiconductors
|
| MC-789406 MC-7894-AZ MC-7894 |
GaAs MULTI-CHIP MODULE
|
Duracell
CEL[California Eastern Labs]
|
| MC-7881 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| FDMF6700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| VS6525 VS6525R0EI_T2 VS6525R0EI/T2 |
VGA single-chip camera module
|
STMicroelectronics
|
| V048K030T070 V048F030T070 |
VI Chip - VTM Voltage Transformation Module
|
VICOR[Vicor Corporation]
|
| V048K020T080 V048F020T080 |
VI Chip - VTM Voltage Transformation Module
|
VICOR[Vicor Corporation]
|
| B048K480T30 B048F480M30 B048F480T30 B048K480M30 |
VI Chip - BCM Bus Converter Module 六芯 BCM的总线转换器模
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
